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IS 14331:1995 Testing for Heat-Resistant Materials

  • Writer: Rohit Bafna
    Rohit Bafna
  • 1 day ago
  • 1 min read

TCR Engineering conducts comprehensive material testing in accordance with IS 14331:1995, a critical standard for evaluating heat-resistant materials. This standard ensures that materials used in high-temperature applications perform reliably under extreme conditions.

Why IS 14331:1995 Matters

IS 14331:1995 outlines the requirements and test methods for materials exposed to elevated temperatures, particularly for power generation, petrochemical, and thermal processing industries. Testing per this standard ensures:

  • Resistance to mechanical deformation at high temperatures

  • Long-term durability under thermal stress

  • Reliable performance in safety-critical environments

Key Tests Conducted at TCR Engineering

Chemical & Structural Evaluation

  • Chemical Test (Clause 4) – Spectro analysis ensures material composition compliance

  • Inclusion Content (DIN 50602) – Detects non-metallic inclusions using microscope

  • Grain Size Test (ASTM E112-24) – Measures grain structure for strength indicators

  • Macro-etch (IS 13015/ASTM E381) – Reveals internal flaws and structural homogeneity

Mechanical Testing

  • Tensile Test (Clause 6.1) – At room temperature

  • Hot Tensile Test (Clause 10.1) – At temperatures up to 600°C, across multiple bands

  • Izod Impact Test (Clause 6.2) – Assesses toughness under dynamic loading

  • Creep & Stress Rupture Test (IS 3407) – Evaluates long-term load-bearing performance at high temperatures

Note: While IS 14331 does not explicitly recommend inclusion or grain size analysis, TCR offers these tests for deeper insight into material quality.

Conclusion

Materials used in high-temperature environments must undergo precise, standard-compliant testing. TCR Engineering provides all critical tests as per IS 14331:1995—ensuring your components meet safety, reliability, and durability benchmarks.

Choose certified testing for uncompromised performance.

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